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High recycling Blasting Media all sizes green silicon carbide fine powder gsic for polishing and grinding


  • Color : Green
  • Content: >98%
  • Basic Mineral: α-SiC
  • Crystal form: Hexagonal crystal
  • Mohs hardness: 3300kg/mm3
  • True density: 3.2g/mm
  • Bulk density: 1.2-1.6g/mm3
  • Specific gravity: 3.20-3.25
  • Product Detail

    APPLICATION

    Green Silicon Carbide Introduction

    Green silicon carbide powder is a high-quality abrasive material that is used for various applications such as polishing and sandblasting. It is known for its excellent hardness, impressive cutting ability, and superior strength. Green silicon carbide is produced by heating a mixture of silica sand and carbon to high temperatures in an electric furnace. The result is a crystalline material with a beautiful green color.

    gsic (58)
    gsic (52)
    gsic (6)

    Green Silicon Carbide Physical Property 

     

    Physical property 
    Crystal shape Hexagonal
    Bulk density 1.55-1.20g/cm3
    Grain density 3.90g/cm3
    Mohs Hardness 9.5
    Knoop Hardness 3100-3400 Kg/mm2
    Shatter strength 5800 kPa·cm-2
    Color Green
    Melting point 2730ºC
    Thermal conductivity (6.28-9.63)W·m-1·K-1
    Linear expansion coefficient (4 - 4.5)*10-6K-1(0 - 1600 C)
    Size Grain distribution Chemical Composition(%)
      D0 ≤ D3 ≤ D50 D94 ≥ SiC ≥ F.C ≤ Fe2O3≤
    #700 38 30 17±0.5 12.5 99.00 0.15 0.15
    #800 33 25 14±0.4 9.8 99.00 0.15 0.15
    #1000 28 20 11.5±0.3 8.0 98.50 0.25 0.20
    #1200 24 17 9.5±0.3 6.0 98.50 0.25 0.20
    #1500 21 14 8.0±0.3 5.0 98.00 0.35 0.30
    #2000 17 12 6.7±0.3 4.5 98.00 0.35 0.30
    #2500 14 10 5.5±0.3 3.5 97.70 0.35 0.33
    #3000 11 8 4.0±0.3 2.5 97.70 0.35 0.33

     


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    1. Grinding and Cutting:   precision grinding of hard metals, ceramic materials, and glass
    2. Sharpening and Honing: sharpening and honing cutting tools such as knives, chisels, and blades
    3. Abrasive Blasting: surface preparation, cleaning, and etching applications
    4. Polishing and Lapping:  precision polishing of lenses, mirrors, and semiconductor wafer polishing
    5. Wire Sawing:  silicon wafers, gemstones, and ceramics
    6. Refractory and Ceramic Industry:  manufacturing crucibles, kiln furniture, and other high-temperature components
    7. Semiconductor Industry: 
    8. Metallurgical Applications

     

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